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NTD23N03R
Power MOSFET
23 A, 25 V, N ? Channel DPAK
Features
?
?
?
?
?
?
Planar HD3e Process for Fast Switching Performance
Low R DS(on) to Minimize Conduction Loss
Low C iss to Minimize Driver Loss
Low Gate Charge
Optimized for High Side Switching Requirements in
High ? Efficiency DC ? DC Converters
Pb ? Free Packages are Available
V (BR)DSS
25 V
http://onsemi.com
R DS(on) TYP
32 m W
N ? CHANNEL
D
I D MAX
23 A
MAXIMUM RATINGS (T J = 25 ° C unless otherwise specified)
Parameter
Drain ? to ? Source Voltage
Gate ? to ? Source Voltage ? Continuous
Symbol
V DSS
V GS
Value
25
± 20
Unit
Vdc
Vdc
G
S
Thermal Resistance, Junction ? to ? Case
Total Power Dissipation @ T C = 25 ° C
Drain Current
? Continuous @ T C = 25 ° C, Chip
? Continuous @ T C = 25 ° C,
Limited by Package
? Single Pulse
Thermal Resistance, Junction ? to ? Ambient
(Note 1)
Total Power Dissipation @ T A = 25 ° C
Drain Current ? Continuous @ T A = 25 ° C
R q JC
P D
I D
I D
I DM
R q JA
P D
I D
5.6
22.3
23
17.1
40
76
1.64
4.5
° C/W
W
A
A
A
° C/W
W
A
1 2
3
4
DPAK
CASE 369AA
(Surface Mounted)
STYLE 2
MARKING
DIAGRAMS
4
Drain
1
3
Gate
Source
Thermal Resistance, Junction ? to ? Ambient R q JA 110 ° C/W
(Note 2)
Total Power Dissipation @ T A = 25 ° C P D 1.14 W
Drain Current ? Continuous @ T A = 25 ° C I D 3.8 A
Operating and Storage Temperature Range T J , T stg ? 55 to ° C
150
Maximum Lead Temperature for Soldering T L 260 ° C
Purposes, 1/8 ″ from case for 10 seconds
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. When surface mounted to an FR4 board using 0.5 sq in pad size.
2. When surface mounted to an FR4 board using minimum recommended pad
size.
1
2
3
4
DPAK ? 3
CASE 369D
(Straight Lead)
STYLE 2
2
Drain
4
Drain
1 2 3
Gate Drain Source
T23N03
A
Y
WW
G
= Device Code
= Assembly Location
= Year
= Work Week
= Pb ? Free Package
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
? Semiconductor Components Industries, LLC, 2009
March, 2009 ? Rev. 5
1
Publication Order Number:
NTD23N03R/D
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